The flat nature of traditional IC packaging design struggles to cope with the chiplet era. Homogeneous disaggregation offers an alternative.
https://www.techdesignforums.com/blog/2024/04/15/putting-chiplet-design-on-the-smart-path/
The technique is becoming increasingly important for designs that need to be flexible, compact and lightweight.
https://www.techdesignforums.com/blog/2024/04/15/rigid-flex-ebook/
DTCO (design technology co-optimization) looks to address systemic verification challenges but the process still needs to be extended.
https://www.techdesignforums.com/blog/2024/04/11/dtco-spie-keynote/
Make it easier to capture issues in 2.5D and 3D designs with multiple chiplets and emerging challenges with this 'shift left' approach.
Arm has launched what the company claims is its highest-performance and most-efficient AI accelerator.
https://www.techdesignforums.com/blog/2024/04/09/arm-ethos-u85-transformer-npu/
How the various features within today's Calibre physical verification family help designers shift left tasks and cut time-to-market.
Certification to ISO 26262 for automotive systems and compatibility with the latest Arm9 generation of processors and the CHI-E interface are among the updates to Arteris’ Ncore cache-coherent ...
https://www.techdesignforums.com/blog/2024/03/18/arteris-extends-safety-and-speed-for-noc/
Arm is working with Cadence and Siemens on separate projects to support its plans in the SDV space.
https://www.techdesignforums.com/blog/2024/03/14/two-projects-digital-twins-sdv/
DVCon Europe is looking for papers to be presented at this year’s event in mid-October.
https://www.techdesignforums.com/blog/2024/03/13/dvcon-europe-call-for-papers/
The board of directors of Accellera Systems Initiative has approved the 2023 edition of the Verilog-AMS standard for release.
https://www.techdesignforums.com/blog/2024/03/04/verilog-ams-2023-release/